1.27mm Pitch Male Dual Row Board to Board Connector Vertical SMT Type w/ Board lock Dip Type ( Har-Flex )

SMC04RD

1.27mm Pitch Male Dual Row Board to Board Connector Vertical SMT Type w/ Board lock Dip Type ( Har-Flex )

Specification

  • Insulator Material: High Temp. Thermoplastic, UL94V-0.
  • Contact Material: Phosphor Bronze.
  • Board Lock Material: Brass.
  • Contact Plating: Au (14µ" / 5µ" / 30µ" Min.) on Contact Area.
    Au (1µ" Min.) or Sn (100µ" Min.) on Soldertail.
    Nickle (Contact-80µ" Min. / Soldertail -50µ" Min.)
  • Board Lock Plating: Sn(100µ" Min.) over Nickel (40µ” Min.)
  • Current Rating: 1.7A Max.
  • Contact Resistance: 25 Milliohms Max.
  • Insulator Resistance: 1000 Megohms Min.
  • Dielectric Withstanding: 500V DC for 1 Minute.
  • Operating Temperature: -55°C ~ +125°C.
  • Max. Processing Temp.: 230°C for 30-60 seconds. 260°C for 10 seconds.
1.27mm Pitch Male Dual Row Board to Board Connector Horizontal SMT Type w/ Board lock Dip Type ( Har-Flex )

SMC03RD

1.27mm Pitch Male Dual Row Board to Board Connector Horizontal SMT Type w/ Board lock Dip Type ( Har-Flex )

Specification

  • Insulator Material: High Temp. Thermoplastic, UL94V-0.
  • Contact Material: Phosphor Bronze.
  • Board Lock Material: Brass.
  • Contact Plating: Au on Contact Area.
    Sn (100µ" Min.) on Soldertail.
    Nickle (Contact – 80µ" Min. / Soldertail – 50µ" Min.)
  • Board Lock Plating: Sn(100µ" Min.) over Nickel (40µ" Min.)
  • Current Rating: 1.7A Max.
  • Contact Resistance: 25 Milliohms Max.
  • Insulator Resistance: 1000 Megohms Min.
  • Dielectric Withstanding: 500V AC for 1 Minute.
  • Operating Temperature: -55°C ~ +125°C.
  • Max. Processing Temp.: 230°C for 30-60 seconds. 260°C for 10 seconds.
1.27mm Pitch Female Dual Row Board to Board Connector Vertical SMT Type w/ Board lock Dip Type ( Har-Flex )

SMC02D

1.27mm Pitch Female Dual Row Board to Board Connector Vertical SMT Type w/ Board lock Dip Type ( Har-Flex )

  • Specification
  • Insulator Material: High Temp. Thermoplastic, UL94V-0.
  • Contact Material: Phosphor Bronze.
  • Board Lock Material: Brass.
  • Contact Plating: Au (1µ" / 5µ" / 30µ" Min.) on Contact Area.
    Au (1 Min.) or Sn (100µ" Min.) on Soldertail.
    Nickle (Contact-80" Min. / Soldertail -50" Min.)
  • Board Lock Plating: Sn(100µ" Min.) over Nickel (40µ” Min.)
  • Current Rating: 1.7A Max.
  • Contact Resistance: 25 Milliohms Max.
  • Insulator Resistance: 1000 Megohms Min.
  • Dielectric Withstanding: 500V DC for 1 Minute.
  • Operating Temperature: -55°C ~ +125°C.
  • Max. Processing Temp.: 230°C for 30-60 seconds. 260°C for 10 seconds.
1.27mm Pitch Female Dual Row Board to Board Connector Horizontal SMT Type w/ Board lock Dip Type ( Har-Flex )

SMC01D

1.27mm Pitch Female Dual Row Board to Board Connector Horizontal SMT Type w/ Board lock Dip Type ( Har-Flex )

Specification

  • Insulator Material: High Temp. Thermoplastic, UL94V-0.
  • Contact Material: Phosphor Bronze.
  • Board Lock Material: Brass.
  • Contact Plating: Au on Contact Area.
    Sn (100µ" Min.) on Soldertail.
    Nickle (Contact - 80µ" Min. / Soldertail – 50µ" Min.)
  • Board Lock Plating: Sn(100µ" Min.) over Nickel (40µ" Min.)
  • Current Rating: 1.7A Max.
  • Contact Resistance: 25 Milliohms Max.
  • Insulator Resistance: 1000 Megohms Min.
  • Dielectric Withstanding: 500V AC for 1 Minute.
  • Operating Temperature: -55°C ~ +125°C.
  • Max. Processing Temp.: 230°C for 30-60 seconds. 260°C for 10 seconds.