1.27mm Pitch Dual Board to Board Male Connector Horizontal SMT TYPE (SMC)

SMC03

1.27mm Pitch Dual Board to Board Male Connector Horizontal SMT TYPE (SMC)

Specification

  • Insulator Material: High Temp. Thermoplastic, UL94V-0. 
  • Contact Material: Phosphor Bronze. 
  • Board Lock Material: Brass. 
  • Contact Plating: Au on Contact Area. Sn (100u" Min.) on Soldertail. Nickle (Contact - 80u" Min. /Soldertail - 50u" Min.) 
  • Board Lock Plating: Sn(100u" Min.) over Nickel (40u" Min.) 
  • Current Resistance: 1.2A Max. 
  • Contact Resistance: 25 Milliohms Max.
  • Insulator Resistance: 1000 Megohms Min. 
  • Dielectric Withstanding: 500V AC for 1 Minute. 
  • Operating Temperature: -55°C ~ +125°C. 
  • Max. Processing Temp.: 230°C for 30-60 seconds. 260°C for 10 seconds.
1.27mm Pitch Dual Board to Board Female Connector Vertical SMT TYPE (SMC)

SMC02

1.27mm Pitch Dual Board to Board Female Connector Vertical SMT TYPE (SMC)

Specification

  • Insulator Material: High Temp. Thermoplastic, UL94V-0. 
  • Contact Material: Phosphor Bronze. 
  • Board Lock Material: Brass. 
  • Contact Plating: Au on Contact Area. Sn (100u" Min.) on Soldertail. Nickle (Contact - 80u" Min. /Soldertail - 50u" Min.) 
  • Board Lock Plating: Sn(100u" Min.) over Nickel (40u" Min.) 
  • Current Resistance: 1.2A Max. 
  • Contact Resistance: 25 Milliohms Max.
  • Insulator Resistance: 1000 Megohms Min. 
  • Dielectric Withstanding: 500V AC for 1 Minute. 
  • Operating Temperature: -55°C ~ +125°C. 
  • Max. Processing Temp.: 230°C for 30-60 seconds. 260°C for 10 seconds.
1.27mm Pitch Dual Board to Board Female Connector Horizontal SMT TYPE (SMC)

SMC01

1.27mm Pitch Dual Board to Board Female Connector Horizontal SMT TYPE (SMC)

Specification

  • Insulator Material: High Temp. Thermoplastic, UL94V-0. 
  • Contact Material: Phosphor Bronze. 
  • Board Lock Material: Brass. 
  • Contact Plating: Au on Contact Area. Sn (100u" Min.) on Soldertail. Nickle (Contact - 80u" Min. /Soldertail - 50u" Min.) 
  • Board Lock Plating: Sn(100u" Min.) over Nickel (40u" Min.) 
  • Current Resistance: 1.2A Max. 
  • Contact Resistance: 25 Milliohms Max.
  • Insulator Resistance: 1000 Megohms Min. 
  • Dielectric Withstanding: 500V AC for 1 Minute. 
  • Operating Temperature: -55°C ~ +125°C. 
  • Max. Processing Temp.: 230°C for 30-60 seconds. 260°C for 10 seconds.
1.27mm Pitch Dual Board to Board Male Connector Vertical SMT TYPE (SMC)

SMC04

1.27mm Pitch Dual Board to Board Male Connector Vertical SMT TYPE (SMC)

Specification

  • Insulator Material: High Temp. Thermoplastic, UL94V-0. 
  • Contact Material: Phosphor Bronze. 
  • Board Lock Material: Brass. 
  • Contact Plating: Au on Contact Area. Sn (100u" Min.) on Soldertail. Nickle (Contact - 80u" Min. /Soldertail - 50u" Min.) 
  • Board Lock Plating: Sn(100u" Min.) over Nickel (40u" Min.) 
  • Current Resistance: 1.2A Max. 
  • Contact Resistance: 25 Milliohms Max.
  • Insulator Resistance: 1000 Megohms Min. 
  • Dielectric Withstanding: 500V AC for 1 Minute. 
  • Operating Temperature: -55°C ~ +125°C. 
  • Max. Processing Temp.: 230°C for 30-60 seconds. 260°C for 10 seconds.