1.27mm Pitch Single Board to Board Female Connector Horizontal SMT TYPE (Mini Bridge)

SMC05

1.27mm Pitch Single Board to Board Female Connector Horizontal SMT TYPE (Mini Bridge)

Specification

  • Insulator Material:High Temp. Thermoplastic, UL94V-0.
  • Contact Material: Phosphor Bronze.
  • Board Lock Materia: I Brass.
  • Contact Plating: Au on Con tact Area.
    Sn (100µ''Min.) on Soldertail.
    Nickle (Contact - 80µ" Min./ Soldertail - 50µ''Min.)
    Board Lock Plating: Sn(100µ''Min.) over Nickel (40µ''Min.)
  • Current Resistance: 5A Max
  • Contact Resistance: 25 Milliohms Max.
  • Insulator Resistance: 1000 Megohms Min.
  • Dielectric Withstanding: 500V AC for 1 Minute.
  • Operating Temperature: 230 for 30~60 seconds.
  • Max. Processing Temp.: 260 for 10 seconds.
1.27mm Pitch Single Board to Board Male Connector Horizontal SMT TYPE (Mini Bridge)

SMC06

1.27mm Pitch Single Board to Board Male Connector Horizontal SMT TYPE (Mini Bridge)

Specification

  • Insulator Material:High Temp. Thermoplastic, UL94V-0.
  • Contact Material: Phosphor Bronze.
  • Board Lock Materia: I Brass.
  • Contact Plating: Au on Con tact Area.
    Sn (100µ''Min.) on Soldertail.
    Nickle (Contact - 80µ" Min./ Soldertail - 50µ''Min.)
    Board Lock Plating: Sn(100µ''Min.) over Nickel (40µ''Min.)
  • Current Resistance: 5A Max
  • Contact Resistance: 25 Milliohms Max.
  • Insulator Resistance: 1000 Megohms Min.
  • Dielectric Withstanding: 500V AC for 1 Minute.
  • Operating Temperature: 230 for 30~60 seconds.
  • Max. Processing Temp.: 260 for 10 seconds.
1.27mm Pitch Single Board to Board Male Connector Vertical SMT TYPE (Mini Bridge)

SMC07

1.27mm Pitch Single Board to Board Male Connector Vertical SMT TYPE (Mini Bridge)

Specification

  • Insulator Material:High Temp. Thermoplastic, UL94V-0.
  • Contact Material: Phosphor Bronze.
  • Board Lock Materia: I Brass.
  • Contact Plating: Au on Con tact Area.
    Sn (100µ''Min.) on Soldertail.
    Nickle (Contact - 80µ" Min./ Soldertail - 50µ''Min.)
    Board Lock Plating: Sn(100µ''Min.) over Nickel (40µ''Min.)
  • Current Resistance: 5A Max
  • Contact Resistance: 25 Milliohms Max.
  • Insulator Resistance: 1000 Megohms Min.
  • Dielectric Withstanding: 500V AC for 1 Minute.
  • Operating Temperature: 230 for 30~60 seconds.
  • Max. Processing Temp.: 260 for 10 seconds.