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SMC01D 1.27mm Pitch Female Dual Row Board to Board Connector Horizontal SMT Type w/ Board lock Dip Type ( Har-Flex )
Specification
- Insulator Material: High Temp. Thermoplastic, UL94V-0.
- Contact Material: Phosphor Bronze.
- Board Lock Material: Brass.
- Contact Plating: Au on Contact Area.
Sn (100µ" Min.) on Soldertail.
Nickle (Contact - 80µ" Min. / Soldertail – 50µ" Min.) - Board Lock Plating: Sn(100µ" Min.) over Nickel (40µ" Min.)
- Current Rating: 1.7A Max.
- Contact Resistance: 25 Milliohms Max.
- Insulator Resistance: 1000 Megohms Min.
- Dielectric Withstanding: 500V AC for 1 Minute.
- Operating Temperature: -55°C ~ +125°C.
- Max. Processing Temp.: 230°C for 30-60 seconds. 260°C for 10 seconds.