• Specification

    • Insulator Material: High Temp. Thermoplastic, UL94V-0.
    • Contact Material: Phosphor Bronze.
    • Board Lock Material: Brass.
    • Contact Plating: Au (14µ" / 5µ" / 30µ" Min.) on Contact Area.
      Au (1µ" Min.) or Sn (100µ" Min.) on Soldertail.
      Nickle (Contact-80µ" Min. / Soldertail -50µ" Min.)
    • Board Lock Plating: Sn(100µ" Min.) over Nickel (40µ” Min.)
    • Current Rating: 1.7A Max.
    • Contact Resistance: 25 Milliohms Max.
    • Insulator Resistance: 1000 Megohms Min.
    • Dielectric Withstanding: 500V DC for 1 Minute.
    • Operating Temperature: -55°C ~ +125°C.
    • Max. Processing Temp.: 230°C for 30-60 seconds. 260°C for 10 seconds.

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1.27mm Pitch Connector ( Har-Flex) - 1.27mm Pitch Male Dual Row Board to Board Connector Vertical SMT Type w/ Board lock Dip Type ( Har-Flex ) OEM / ODM Inquiry Information

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