• Specification

    • Housing: Lcp, High Temperature Thermoplastic, UL94V-0 Rated. (color: Nature)
    • Terminal: High Conductivity Copper; T: 0.20mm
    • Cap: Stainless; T: 0.20mm
    • Contact Area: Gold Plating (see Ordering Information)
    • Solder Area: Tin Plating 80 Min.
    • Underplate Plated: Nickel 50 Min.
    • Cap Finish No Plated

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0.8mm Pitch OCP High Speed 12G Board to Board - 0.8mm Pitch OCP Hight Speed 12G Board to Board Connector 7.7H Receptacle Connector OEM / ODM Inquiry Information

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