• Specification

    • Insulator Material:High Temp. Thermoplastic, UL94V-0.
    • Contact Material: Phosphor Bronze.
    • Board Lock Materia: I Brass.
    • Contact Plating: Au on Con tact Area.
      Sn (100µ''Min.) on Soldertail.
      Nickle (Contact - 80µ" Min./ Soldertail - 50µ''Min.)
      Board Lock Plating: Sn(100µ''Min.) over Nickel (40µ''Min.)
    • Current Resistance: 5A Max
    • Contact Resistance: 25 Milliohms Max.
    • Insulator Resistance: 1000 Megohms Min.
    • Dielectric Withstanding: 500V AC for 1 Minute.
    • Operating Temperature: 230 for 30~60 seconds.
    • Max. Processing Temp.: 260 for 10 seconds.

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1.27mm Pitch Single Row Connector (Mini Bridge) - 1.27mm Pitch Single Board to Board Male Connector Horizontal SMT TYPE (Mini Bridge) - OEM / ODM Inquiry Information

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