1.27mm Pitch Single Board to Board Male Connector Vertical SMT TYPE (Mini Bridge)
Specification
- Insulator Material:High Temp. Thermoplastic, UL94V-0.
- Contact Material: Phosphor Bronze.
- Board Lock Materia: I Brass.
- Contact Plating: Au on Con tact Area.
Sn (100µ''Min.) on Soldertail.
Nickle (Contact - 80µ" Min./ Soldertail - 50µ''Min.)
Board Lock Plating: Sn(100µ''Min.) over Nickel (40µ''Min.)
- Current Resistance: 5A Max
- Contact Resistance: 25 Milliohms Max.
- Insulator Resistance: 1000 Megohms Min.
- Dielectric Withstanding: 500V AC for 1 Minute.
- Operating Temperature: 230℃ for 30~60 seconds.
- Max. Processing Temp.: 260℃ for 10 seconds.