• Specification

    • Insulator Material: High Temp. Thermoplastic, UL94V-0. 
    • Contact Material: Phosphor Bronze. 
    • Board Lock Material: Brass. 
    • Contact Plating: Au on Contact Area. Sn (100u" Min.) on Soldertail. Nickle (Contact - 80u" Min. /Soldertail - 50u" Min.) 
    • Board Lock Plating: Sn(100u" Min.) over Nickel (40u" Min.) 
    • Current Resistance: 1.2A Max. 
    • Contact Resistance: 25 Milliohms Max.
    • Insulator Resistance: 1000 Megohms Min. 
    • Dielectric Withstanding: 500V AC for 1 Minute. 
    • Operating Temperature: -55°C ~ +125°C. 
    • Max. Processing Temp.: 230°C for 30-60 seconds. 260°C for 10 seconds.


1.27mm Pitch Dual Board to Board Connector (SMC) - 1.27mm Pitch Dual Board to Board Male Connector Vertical SMT TYPE (SMC) - OEM / ODM Inquiry Information

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