• Specification

    • Housing: Lcp, High Temperature Thermoplastic,ul94v-0 Rated. ( Color: Nature)
    • Terminal: High Conductivity Copper; T:0.15mm
    • Cap:stainless; T:0.20mm
    • Contact Area: Gold Plating (see Ordering Information)
    • Solder Area: Tin Plating 80u" Min
    • Underplate Plated: Nickel 50u" Min
    • Cap Finish No Plated

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0.8mm Pitch OCP High Speed 12G Board to Board - 0.8mm Pitch OCP High Speed 12G Board to Board Connector 3.7H Receptacle Connector OEM / ODM Inquiry Information

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